dr hab. Agata SKWAREK, prof. UMG

dr hab. Agata SKWAREK, prof. UMG

Dorobek naukowy

  • Pełna lista publikacji jest dostępna TUTAJ

 

  • 2020
    1. Skwarek A., Ptak P., Górecki K., Hurtony T., Illés B., “Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies”, Materials, vol. 13/7, 2020, 1563
    2. Skwarek A., Illés B., Hurtony T., Bušek D., Dušek K., “Effect of recrystallization on β to α-Sn allotropic transition in Sn99.3Cu0.7 solder alloy inoculated with InSb”, Materials, vol. 13/4, 2020, 968
    3. Yahaya M.Z., Nazeri M.M.F., Kheawhom S., Illés B., Skwarek A., Mohamad A.A., “Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching”, Materials Research Express, vol. 7, 2020, 016583
  • 2019
    1. Szwagierczak D., Kulawik J., Skwarek A.: "Influence of Processing on Microstructure and Electrical Characteristics of Multilayer Varistors", Journal of Advanced Ceramics, vol. 8/3, 2019, 408-417
    2. Illés B., Skwarek A., Ratajczak J., Dušek K., Bušek D.: "The Influence of the Crystallographic Structure of the Intermetallic Grains on Tin Whisker Growth", Journal of Alloys and Compounds, vol. 785, 2019, 774-780
    3. Synkiewicz B., Skwarek A., Szwagierczak D., Kulawik J.: "Sintering Aids for LTCC Electronics Elements - Heating Microscope Studies and Microstructure Analysis", Acta Physica Polonica A, vol. 135/4, 2019, 564-566
    4. Illés B., Skwarek A., Batorfi R., Hurtony T., Harsanyi G.: "Electrical Characterization of b-a-Sn Transition in High Tin Content Solder Alloys with Different Inoculators", Acta Physica Polonica A, vol. 135/5, 2019, 935-937
    5. Illés B., Skwarek A., Géczy A., Jakab L., Bušek D., Dušek K.: "Effect of the Vapour Concentration Decrease on the Solder Joints Temperature in a Vacuum Vapour Phase Soldering System", Soldering and Surface Mount Technology, vol. 30/2, 2019, 66-73
  • 2018
    1. Skwarek A., Illés B., Witek K., Hurtony T., Tarasiuk J., Wroński S., Synkiewicz B.: "Reliability Studies of InnoLot and SnBi Joints Soldered on DBC Substrate", Soldering and Surface Mount Technology, vol. 30/4, 2018, 205-212
    2. Skwarek A., Socha R.P., Szwagierczak D., Zachariasz P.: "Investigation of the Microstructure and Chemical Composition of CaCu3Ti4O12 Multilayer Elements Using SEM, EDA and XPS Methods", Acta Physica Polonica A, vol. 134/1, 2018, 318-321
    3. Zachariasz P., Skwarek A., Illés B., Zukrowski J., Hurtony T., Witek K.: "Mossbauer Studies of beta alfa Phase Transition in Sn-Rich Solder Alloys", Microelectronics Reliability, vol. 82, 2018, 165-170
  • 2017
    1. Kulawik J., Szwagierczak D., Skwarek A.: "Electrical and Microstructural Characterization of Doped ZnO Based Multilayer Varistors", Microelectronics International, vol. 34/3, 2017, 116-120
    2. Skwarek A., Illés B., Horvath B., Géczy A., Zachariasz P., Bušek D., Identification and characterization b-a-Sn Transition by Electrical Resistance Measurements in SnCu1 Bulk Alloy Inoculated with InSb, article in press, Journal of Materials Science: Materials in Electronics, vol. 28, 2017, 16329-16335
    3. Illés B., Skwarek A., Géczy A., Kramer O., Bušek D., Numerical modelling of the heat and mass transport processes in a Vacuum Vapour Phase Soldering System, International Journal of Heat and Mass Transfer, vol. 114, 2017, 613-620
    4. Illés B., Skwarek A., Batorfi R., Ratajczak J., Czerwiński A., Krammer O., Medgyes B., Horvath B., Hurtony T.: "Whisker Growth from Vacuum Evaporated Submicron Sn Thin Films by Interface Flow Mechanism", Surface and Coatings Technology, vol. 311, 2017, 216–222
    5. Skwarek A., Illés B., Synkiewicz B., Wroński S., Tarasiuk J., Witek K.: "Characterization of the solder joints made with VPS on DBC Substrate", Journal of Materials Science: Materials in Electronics vol. 28/, 2017, 1769–1776
  • 2016
    1. Skwarek A., Zachariasz P., Żukrowski J., Synkiewicz B., Witek K.: " Early stage detection of β→α transition in Sn by Mössbauer spectroscopy, Materials Chemisty and Physics, vol. 182, 2016, 10-14
    2. Szwagierczek D., Kulawik J., Synkiewicz B., Skwarek A.: “Multilayer capacitors with bismuth copper tantalate dielectric fabricated in LTCC technology”, Microelectronics International, vol. 33/3, 2016, pp. 118 – 123
    3. Illés B., Géczy A., Skwarek A., Bušek D., Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering, International Journal of Heat And Mass Transfer, vol. 101, 2016, 69-75
  • 2015
    1. Skwarek A., Zachariasz P., Kulawik J., Witek K.: "Inoculator Dependant Induced Growth of a-Sn", Materials Chemistry and Physics, vol. 166, 2015, 16-19
    2. Skwarek A., Synkiewicz B., Kulawik J., Guzdek P., Witek K., Tarasiuk J.: "High Temperature Thermogenerators Made on DBC Substrate Using Vapour Phase Soldering", Soldering and Surface Mount Technology, Vol. 27 Iss 3, 2015, 125-128
    3. Drabczyk K., Socha R.P., Skwarek A.: "Copper Deposition on Screen Printed Electrical Paths for Solar Cell Application", Circuit World, vol. 41, nr. 3, 2015, 98-101
    4. Synkiewicz B., Skwarek A., Witek K.: “Vapour Phase soldering used for quality improvement of  Semiconductor Thermogenerators (TEGs) assembly”, Materials Science in Semiconductor Processing, 38, 2015, 346–351

 

  • Patenty:
  1. Skwarek A., Kulawik J., Witek K.: "Sposób oceny podatności stopów cyny na zarazę cynową", numer zgłoszenia do UPRP: P404330, numer patentu: 221478, data zgłoszenia: 2013-06-14

Podmiot udostępniający: 

WE

Wytworzył informację:

Ł.Buchert
12.05.2020
Wprowadzenie:
Ł.Buchert 12.05.2020
Ostatnia modyfikacja:
Ł.Buchert 26.10.2020